With the continuous evolution of LED materials and packaging technology, the brightness of LED products is continuously improved, and the application of LEDs is becoming more and more widely. The use of LEDs as backlights for displays is a hot topic recently, mainly due to different kinds of LED backlight technologies. The color, brightness, life, power consumption and environmental appeal are more advantageous than the traditional cold cathode tube (CCFL), which attracts the active investment. The initial single-chip LEDs were not very powerful, had limited heat generation, and had little thermal problems, so the package was relatively simple. However, with the continuous breakthrough of LED material technology in recent years, the packaging technology of LED has also changed. From the early single-chip gun-type package, it has gradually developed into a flat, large-area multi-chip package module; its operating current is from early 20mA. The low-power LEDs on the left and right have progressed to the current high-power LEDs of 1/3 to 1A. The input power of a single LED is as high as 1W or more, and even the 3W and 5W package modes are more evolved. Since the heat problem caused by the high-brightness and high-power LED system will be the key to affecting the function of the product, to quickly discharge the heat generated by the LED component to the surrounding environment, it is necessary to start with the thermal management of the package level (L1 & L2). At present, the industry practice is to connect the LED chip to a heat spreader with solder or thermal paste, and reduce the thermal impedance of the package module through the heat spreader. This is also the most common LED package module on the market, mainly from Lumileds. LED internationally renowned manufacturers such as OSRAM, Cree and Nicha. Many terminal applications, such as mini projectors, automotive and lighting sources, require more than a thousand lumens or tens of thousands of lumens for a given area. Single-chip package modules are clearly inadequate. Going to the multi-chip LED package and directly bonding the chip to the substrate is a future development trend. The heat dissipation problem is the main obstacle in the development of LEDs for lighting objects. The use of ceramic or heat pipes is an effective way to prevent overheating. However, the heat management solution increases the cost of materials. The purpose of high-power LED heat management design is to effectively reduce R junction-to-case is one of the material-based solutions that provide heat dissipation from the chip, providing low thermal resistance but high conductivity, allowing heat to be transferred directly from the chip through die attach or hot metal methods. The outside of the package housing. Of course, the heat dissipation components of LEDs are similar to the heat dissipation of CPUs. They are mainly air-cooled modules composed of heat sinks, heat pipes, fans and thermal interface materials. Of course, water cooling is also one of the thermal countermeasures. In the current hottest large-size LED TV backlight module, the 40-inch and 46-inch LED backlights have input powers of 470W and 550W respectively, 80% of which are converted into heat, and the required heat dissipation is about 360W and 440W or so. So how do you take this heat away? At present, there is water cooling in the industry for cooling, but there are doubts about high unit price and reliability. It is also useful to use heat pipes with heat sinks and fans for cooling. For example, the 46-inch LED backlight LCD TV of Japanese manufacturer SONY, but the fan consumes power and Problems such as noise still exist. Therefore, how to design a fanless cooling method may be an important key to determine who will win in the future. Here are some materials for heat dissipation and heat dissipation. Heat dissipation method In general, the heat sink can be divided into active heat sink and passive heat sink according to the way heat is removed from the heat sink. The so-called passive heat dissipation means that the heat of the heat source LED light source is naturally radiated into the air through the heat sink, and the heat dissipation effect is proportional to the size of the heat sink, but because of the natural heat dissipation, the effect is of course greatly reduced, and is often used in those space spaces. In equipment that is not required, or used to dissipate heat for components that generate less heat. For example, some popular motherboards also adopt passive heat dissipation on the North Bridge. Most of them adopt active heat dissipation. Active heat dissipation is forced by heat sinks such as fans. The heat emitted by the heat sink is taken away, which is characterized by high heat dissipation efficiency and small size of the device. Active heat dissipation, subdivided from the heat dissipation method, can be divided into air cooling, liquid cooling, heat pipe cooling, semiconductor refrigeration, chemical refrigeration and so on. Air-cooled air-cooled heat is the most common form of heat dissipation, and in comparison, it is also a cheaper way. Air cooling is essentially a fan that takes away the heat absorbed by the heat sink. It has the advantages of relatively low price and convenient installation. However, it is highly dependent on the environment, such as rising temperatures and overheating performance. We adopt the advanced technology imported from Europe, patented technology, specialized software to optimize the design for Dry Type Transformer. The core is made of cold-rolled grain-oriented silicon steel sheet which cut in step-lap by GEORG Germany TBA core cutting lines and laminated by the method of fifth-order step-by-step stacking technology, enabling the no-load performance of the core to improve greatly. The epoxy resin from American HUNTSMAN is adopted for the windings which casted in the vacuum resin casting machine imported from HEDRICH, Germany. The winding material ensures good permeability, no bubbles occur, which leads to minimum partial discharge. The HV and LV winding mate with each other tightly, which ensures solid strength of structure and capability to withstand short circuit and vibration. Under normal service condition, the service life of dry type transformer is 30 years. No crack will form on the surface of transformer winding due to temperature variation as long as the transformer runs under normal service condition. Dry Type Transformer Dry Type Transformer,High Quality Special Transformer,1600Kva Dry-Type Transformer,800Kva Dry-Type Transformer Hangzhou Qiantang River Electric Group Co., Ltd.(QRE) , https://www.qretransformer.com